BASF announced that Weidmüller is using Ultramid® Advanced N3U41 G6 in the PCB connectors and terminals of its new OMNIMATE® 4.0 product family, a solution designed for power electronics applications that demand durability, safety, and efficiency in manufacturing processes.
The material, based on high-performance polyphthalamide, combines thermal resistance, dimensional stability, chemical resistance, and electrical properties suitable for electrical and electronic components subjected to demanding conditions.
According to BASF, these characteristics enhance the robustness of components used in printed circuit board connectors and terminals.
RAL colors for secure PCB assembly
One of the main advantages of Ultramid® Advanced N3U41 G6 is its flexible coloring capability in multiple RAL colors, including shades such as orange, blue, and green.
This feature allows PCB connectors and terminals to be adapted to the color codes used by the electrical and electronics industry to facilitate assembly, identification, and safe maintenance of components.
BASF indicated that the relevant UL yellow cards apply to all colors, allowing customers to respond flexibly to color coding requirements without compromising key certifications for these types of applications.
Resistant PPA for reflow soldering
BASF’s PPA also offers high temperature resistance, a key property for reflow soldering, a process used to attach electrical and electronic components to printed circuit boards.
This capability supports the automated manufacturing of high-performance electronics in sectors such as drive technology, power supply, and electrical distribution.
According to Weidmüller, the OMNIMATE® 4.0 family is geared toward fully automated wiring processes and allows for fast, tool-free connections.
The company highlights that its PCB connectors transmit power in a compact design and meet high-voltage requirements.
Materials for miniaturized electronics
The use of Ultramid® Advanced N3U41 G6 responds to the growing demands of power electronics, where materials must withstand high temperatures, offer long-term electrical insulation, and maintain dimensional stability in complex environments with humidity, dust, or dirt.
The material features a high comparative tracking index, CTI of 600 according to IEC 60112, and a relative thermal index, RTI, of 150°C.
These properties make it suitable for the miniaturization of electrical components by allowing for shorter creepage distances while maintaining reliable performance in demanding applications.
BASF strengthens its Ultramid Advanced portfolio
Andreas Stockheim, from PPA business management at BASF, noted that the company succeeded in convincing Weidmüller through both the material’s performance and the wide range of available colors.
Furthermore, BASF highlights that it can offer pre-colored granules and UL-certified masterbatches for applications requiring self-coloring.
For his part, Johann Klippenstein, head of device connectors at Weidmüller, stated that OMNIMATE® 4.0 is ideal for fully automated wiring processes and that BASF’s PPA fits this concept because it maintains high mechanical and electrical properties even in small connectors.
With this application, BASF reinforces the role of its Ultramid® Advanced portfolio in the next generation of high-performance, lightweight plastic components for electronics, automotive, mechanical engineering, and consumer goods.
Source and photo: https://www.basf.com/