Inspenet invites you to connect today at 17:30 (Central Time) to the panel“Cutting-Edge NDT 2025: New Technologies & Industry Trends“, a space designed to analyze the most recent innovations in the Non Destructive Testing (NDT) and its impact on the industry.
Global experts present at the Panel Discussion
The virtual session will be moderated by Richard Blaser with the participation of key industry figures:
- Wade JensteadVice President of Sales for the Americas at Eddyfi Technologieswill provide insight into the application of advanced solutions in complex industrial environments.
- Brian S. WhiteLab Manager at Carestream NDTwill present a case study titled “Flexible DDA’s on Pipeline Weld’s”, focused on the evaluation of pipeline welds with flexible digital detectors.
- Dr. David AlleyneCEO of Guided Ultrasonic Ltd.will present his method of inspecting corrosion under insulation with Wavemaker® and QSR® technologies.
- Mohammed Abufoura global NDT consultant, will discuss the challenges and opportunities in the digital transformation of NDT.
This panel is an opportunity to learn first-hand about emerging trends, the digitization of inspection processes and the technologies that are redefining the industry landscape. The discussion is aimed at engineers, inspectors, asset integrity specialists and professionals looking to stay current in a highly technological sector.
Participating companies and sponsors
The companies participating in the event are:
- Eddyfi Technologies
- Carestream NDT
- Guided Ultrasonic Ltd.
The Panel Discussion is also supported by prominent sponsors such as HMT, Eddyfi Technologies, Guided Ultrasonic Ltd, Carestream, The Equipcon, Vecor Pipeline Integrity, Viper Imaging and AsInt.
Access from Inspenet’s LinkedIn account
The broadcast will take place from Inspenet’s official LinkedIn account of Inspenetallowing direct interaction with the specialists. It is the ideal time to clarify doubts, share ideas and update on key topics in non-destructive inspection.
Come and confirm your attendance!
Source and photo: Inspenet
